New Desktop DDR3 8GB Ram

Description

*Specification*

• Free Delivery

• Memory Size: 8GB
The module has a total memory capacity of 8GB, which is a common and effective size for modern laptops, ultrabooks, and compact desktop systems. 8GB is typically sufficient for everyday computing tasks such as browsing, media consumption, and light gaming, as well as multitasking with multiple applications open.

• Memory Type: DDR3L
DDR3L refers to Low Voltage DDR3, which operates at a reduced voltage of 1.35V compared to the standard 1.5V of DDR3 memory. This lower voltage helps to conserve power, which is particularly beneficial in portable devices like laptops or energy-efficient desktops.

• Memory Speed: 1600 MHz
The memory operates at a speed of 1600 MHz (also referred to as 12800 MT/s in terms of data transfer rate). This speed is typical for DDR3L memory and offers a good balance of performance for general computing tasks. While newer systems might use DDR4, 1600 MHz is still a solid speed for older systems or budget devices.

• Memory Package: SO-DIMM
SO-DIMM stands for Small Outline Dual Inline Memory Module. This form factor is used primarily in laptops, mini-PCs, and other compact systems. SO-DIMM modules are smaller than regular DIMMs, which are used in desktop PCs, and have a reduced pin count.

• Pin Configuration: 204 pins
204 pins is the standard pin configuration for DDR3L SO-DIMM memory modules. This pin count is designed to fit into the smaller SO-DIMM slot used in laptops and compact desktops. The 204-pin configuration is typical for DDR3 and DDR3L memory.

• Bus I/O Configuration: Unbuffered
This memory module is unbuffered, meaning there is no additional register or buffer between the memory and the memory controller. Unbuffered memory is typically faster and has lower latency, making it ideal for consumer systems like laptops. However, it is less stable than buffered memory in systems requiring large amounts of RAM (such as servers).

• Error Correction: Non-ECC
Non-ECC stands for Non-Error-Correcting Code memory, which means this module does not have built-in error detection or correction. Non-ECC memory is commonly used in consumer devices where error correction is not as critical. ECC memory is used primarily in servers or workstations where data integrity is essential.

• CAS Latency: CL11
CAS Latency (CL) is the delay time (in clock cycles) it takes for the memory to respond to a read command. CL11 is the CAS latency for this module, which is fairly typical for DDR3L memory running at 1600 MHz. While lower CAS latency (e.g., CL9 or CL10) can offer slightly better performance, the difference in real-world performance is often minimal for general computing tasks.

• Connector Material: Gold
The connectors (pins) of this memory module are made from gold, which is commonly used in high-quality memory modules because of its excellent conductivity and resistance to corrosion. Gold connectors ensure reliable electrical connections and long-term durability.

• Module Configuration: 512M x 64
This configuration refers to the internal structure of the memory chips. 512M x 64 indicates the memory is made up of 512 megabits (Mb) per chip, and there are 64 data lines per chip. This is a common configuration for DDR3L modules and indicates how the memory is organized internally, which ultimately affects how data is read and written.

• Voltage: 1.35V
The 1.35V operating voltage is standard for DDR3L (Low Voltage) memory. This lower voltage reduces power consumption compared to standard DDR3 (which typically operates at 1.5V), making this module more energy-efficient. This is especially beneficial in laptops and other portable devices where power efficiency is crucial for extending battery life.